-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA International 2000 Products
December 31, 1969 |Estimated reading time: 4 minutes
BGA Inspection
The 3-D BGA Inspection System's lens design reportedly offers depth of field from a magnitude of 50 to 200X. The lens can be rotated to yield clear 3-D images from various angles for inspection of solder joints, solder paste prints, surface structure, placement alignment, presence of flux, microcracking and more. The system is constructed of ESD-safe components. O.C. White Co., Three Rivers, Mass.
Mobile Training Center
This mobile training center is said to be the country's first and only fully equipped mobile solder training classroom for solder skills/rework training and certification. It has 10 complete SMT rework stations available for students to learn the latest and safest rework/repair techniques. The center is available for certification to standards such as IPC-A-610C, J-STD-001, IPC-7711 and 7721 as well as custom classes. The training center goes to the customer's site, allowing rework personnel to remain at their facility. BEST Inc., Rolling Meadows, Ill.
Thermal Shock Resistant Epoxy
3862 is a medium-viscosity, thermally conductive epoxy potting compound for electronic applications that require thermal shock resistance and thermal conductivity. The material reportedly offers low thermal expansion, excellent wetting and flow capabilities, high heat transfer, and electrical properties. It cures when exposed to 100°C temperatures for two hours or 180°C for one hour. Loctite Corp., Rocky Hill, Conn.
SMT Pins, Headers
SMT mountable PCB pins and headers are said to exploit capillary action for enhanced solder joint strength. Pins are available in square or round designs in a variety of sizes from 0.025 to 0.080" with tin/lead or gold finish. Headers are available in various pin lengths and sizes. Feeders either are available or in development to present these products in a flex-cell SMT environment. Zierick Manufacturing Corp., Mt. Kisco, N.Y.
Printer/Applicator
The PA1000t printer/applicator reportedly has quick setup and changeover. With the user configuration of the applicator pad, the unit can be used for top or side applications. The tamp head size can vary, accommodating labels from 2 x 1" to 4.5 x 8". The system reportedly can print/apply up to 35 4 x 6" labels per minute. Tharo Systems Inc., Brunswick, Ohio.
Electrically Conductive Adhesive
CE 3103 is a one-component, thermosetting electrically conductive adhesive that is a lead-free alternative to solder for SMD interconnect. The adhesive reportedly offers ultra-fine-pitch resolution when printed. It is also syringe dispensable and may be used with Sn, Sn/Pb, and OSP-copper PCB metallizations. It will cure at low temperatures or following a typical eutectic solder reflow cycle. Emerson & Cuming, Billerica, Mass.
In-line X-ray
The AXI line is said to be a high-speed, automated in-line X-ray system for non-destructive inspection of PCBs with BGAs. Designed for a wide range of applications requiring X-ray, the system inspects and verifies hidden solder connections and other critical features on complex electronic assemblies. CR Technology, Aliso Viejo, Calif.
Thermal Profiler
The SlimKIC 2000 thermal profiler reportedly enhances real-time process control of reflow processing with both tin/lead and lead-free solder. The profiler has new hardware and next-generation software to speed and simplify oven profiling. The addition of new software also automates the oven setup process and is said to ensure that the optimal profile is selected. For lead-free applications requiring higher processing temperatures, the software targets the appropriate profile to fit within the center of the smaller process widow. KIC Thermal Profiling, San Diego, Calif.
Reflow System
The Pyramx reflow system features forced impingement technology with 24" processing capability and a maximum temperature to 350°C. The system reportedly can be reconfigured to adapt to changing requirements. It has a flux management system and remote cooling arrangement. BTU International, North Billercia, Mass.
Rework System
The Wide Body Sniper II rework system has the capacity and heating power to rework large-area PCBs. Its 12 x 12" forced hot air panel heather has 3,600 W of heating power. Featuring a 20 x 24" board size handling capacity, the system reportedly can download thermal profiles developed and stored on a PC and can reproduce those profiles as well as store them. A.P.E. South, Key Largo, Fla.
Laser Marking Software
LightWriter software for this company's semiconductor and industrial laser marking systems runs on Windows NT and is said to provide graphics importation capabilities, high-speed marking and host communications via TCP/IP networks. Additionally, the software reportedly can mark True Type fonts, logos, data matrix, serialization, and data and lot codes. GSI Lumonics, Ontario, Canada.
Desoldering Handpiece
The SX-80 Sodr-X-Tractor handpiece features a disposable cardboard solder and flux trap that reportedly reduces handpiece cleaning and provides a means of reclaiming solder. It uses a modular plug-in heater that is said to decrease maintenance downtime. Pace Inc., Laurel, M.D.
Solder Preforms
These solder preforms are specialty solder shapes used in the electronics industry for manufacturing and PCB repair. They are made from the same Electropure solder and alloys that this company's paste, wire and bar are manufactured with. Preforms reportedly can be used when components must be attached to previously stenciled boards, where a specific amount of solder must be applied, or there is a stenciling incompatibility. All shapes are available with or without flux coating. AIM, Cranston, R.I.
Rework Center
System M-7500 is said to remove components and remount them, cleaning the solder pads and dispensing paste or adhesive for ICs, PLCCs, QFPs and sockets. With optional accessories, the system can remount or reball BGAs, CSPs and mBGAs. Manncorp, Huntingdon Valley, Pa.
Wavesoldering Management
The Wave Management system reportedly cuts setup time and streamlines the wavesoldering process by automatically resetting process settings "on-the-fly," reducing the need for batch processing. In addition to conveyor speed, solder pump speed, and solder temperature, the system incorporates closed-loop wave height control, automatic solder pot height adjustment, and an automatic back plate height adjustment. Vitronics Soltec, Stratham, N.H.