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Solder Paste Inspection
December 31, 1969 |Estimated reading time: Less than a minute
SE 300 high-speed, high-resolution, 3-D solder paste inspection system reportedly is capable of performing 100 percent inspection at production line speeds. The system automatically measures height, volume, area and bridging, and notifies the operator of any parameters trending outside user-specified limits. There is a choice of two operating modes: high-speed mode, designed for fine-pitch QFPs and other traditional components, that reportedly inspects 4 sq. in per second; and high-resolution mode, used for inspecting smaller components such as CSPs and 0402 discretes, that reportedly inspects at 1.5 sq. in per second. Both speeds can be combined in the same inspection program.
CyberOptics Corp.
Minneapolis, Minn.