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Back-end Services
December 31, 1969 |Estimated reading time: Less than a minute
Offering complete solutions for all aspects of back-end packaging, this company is said to examine the packaging operation to determine the package type and operations best suited for each specific component, allowing parts to be delivered without lead or device damage, and according to JEDEC standards. Services include: tape-and-reel packaging with in-line lead inspection; BGA and µBGA ball inspection and taping; drop test engineering services, lead form and trim; and lead/mark inspection and lead conditioning.
onQ Technology Inc.
Austin, Texas.