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ADHESIVES/ COATINGS/ ENCAPSULANTS
December 31, 1969 |Estimated reading time: Less than a minute
Loctite - 3567
The first commercially available reworkable underfill, Loctite 3567 provides the reliability and processing ease of conventional thermoset underfills. It allows flip chips to be replaced on any device after testing determines that a chip is defective, minimizing board disposal and improving the cost-effectiveness of the manufacturing process. The underfill improves the reliability of BGA and CSP assemblies, particularly important for roughly handled consumer electronic applications. Simply heating the defective device to standard rework temperatures allows it to be removed from the PCB. Gentle high-speed brushing eliminates any remaining residue and prepares the site for a replacement device.