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APEX 2000 REVIEW
December 31, 1969 |Estimated reading time: 2 minutes
HERNDON, Va. - The National Electronics Manufacturing Initiative (NEMI) kicked off its Roadmap 2000 with a day-long working session immediately following the IPC SMEMA Council`s Electronics Assembly Process Exhibition and Conference (APEX) in Long Beach, Calif. An estimated 140 individuals representing more than 60 OEMs, contract manufacturers (CM), equipment vendors, suppliers, universities and government agencies participated in the meeting, which launches NEMI`s year-long activities to map the future technology needs of the North American electronics industry.
Work on the NEMI roadmap is organized into five product sector groups (PSG) - low-cost, hand-held, cost/performance, high-performance and harsh environment - and 18 technology working groups (TWG) - board assembly; digital silicon technology; displays; energy storage systems; environmentally conscious manufacturing; factory information systems; final assembly; interconnect substrates/ceramic; interconnect substrates/organic; mass data storage; modeling, simulation and design tools; optoelectronics; packaging; passive components; RF components; supply chain management; test, inspection and measurement; and thermal management. The PSGs define future product attributes plus key cost and density drivers, while the TWGs use this information to help forecast trends for their respective technology areas.
Several emerging technologies and market trends will be integrated into Roadmap 2000; among these is a new TWG to address thermal management. Higher frequencies and smaller form factors are making it increasingly essential to model the thermal load and heat sinking of an entire system. Additional topics to be considered in terms of potential impact on electronics manufacturing technology include microelectromechanical systems (MEMS) technology, lead-free manufacturing, integrated optics/fiber optics cable, wireless Internet appliances, virtual manufacturing and enterprise information technology.
"Technologies and market trends are changing at a very rapid pace in the electronics industry, and remaining competitive in this environment means successfully anticipating where the market will go," said Jim McElroy, NEMI`s executive director and CEO. "The NEMI Roadmap helps electronics manufacturers keep their fingers on the pulse of the latest innovations and helps them plan for future manufacturing investments."
The NEMI Roadmap maintains links with other industry roadmaps and organizations, including SIA (semiconductors), IPC (interconnection substrates), the Optoelectronics Industry Development Association (optoelectronics and optical storage), the National Storage Industry Consortium (magnetic and optical storage), the U.S. Display Consortium (displays), the Supply Chain Council (supply chain management), and the International Microelectronics Packaging Society (ceramic substrates).
After the initial meeting, the TWGs will meet regularly by teleconference to develop their roadmaps. One more face-to-face meeting is held in June, and roadmap chapters are submitted in October. The roadmap is then assembled, edited and published by the end of the year. For more information, contact NEMI at (703) 834-0330 or e-mail info@nemi.org.