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Surface Mount Package
December 31, 1969 |Estimated reading time: Less than a minute
This three-terminal version of the company`s Powermite surface mount product line is designed to replace larger and higher profile D-PAK and TO-220 packages used for semiconductor devices. The devices are said to be less than 1.1 mm high and require 5.3 x 4.8 mm on a PCB. The product also reportedly has a rugged construction and provides thermal impedance and resistance characteristics.
Microsemi Corp.
Santa Ana, Calif.