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Rework Stations
December 31, 1969 |Estimated reading time: Less than a minute
The Summit 2100 Series is designed to increase the speed and accuracy of rework, and handles BGAs, µBGAs and flip chips on boards up to 18 x 22" with 2" vertical clearance. Featuring Auto Profile Software, the series is said to automatically set and maintain proper reflow temperature for any board/component combination. A user-friendly, menu-driven interface allows the user to program the complete rework sequence. The series automates the entire rework process, including component removal, residual solder removal (scavenging), solder paste application, component replacement and solder reflow.
Nicolet Imaging Systems/Sierra Research & Technology (NIS/SRT)
San Diego, Calif.