-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MicroBGA Rework
December 31, 1969 |Estimated reading time: Less than a minute
This micro-stencil and nozzle are designed specifically for the rework of Tessera`s microBGA component. The stencil reportedly fits the pattern and is the same size as the part. Because the stencil is viewed with a camera by a prism that views both the stencil and PCB pad pattern simultaneously, the operator is said to be able to align the stencil perfectly to the PCB. The stencil is trapezoidal etched, and can be lowered multiple times if solder paste is not 100 percent deposited in all holes.
OK International
Menlo Park, Calif.