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CSP and µBGA Test Applications
December 31, 1969 |Estimated reading time: Less than a minute
The 0.010" diameter Fuzz Button for test sockets is said to enable the company`s high-performance test sockets to employ 0.5 mm pitch. These small, cylindrically shaped electrical contacts with a low inductance and 0.100 k actuation performance are suitable for µBGA and CSP applications. Their composition is gold-plated beryllium-copper, molybdenum, tungsten and nickel-chromium. Suitable for electrical conduction for DC-to-microwave frequencies, they come in sizes from 0.010 to 0.50".
Tecknit Interconnection Products
Cranford, N.J.