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Flip Chip Underfill Encapsulants
December 31, 1969 |Estimated reading time: Less than a minute
The ME-525 series of capillary-flow underfill encapsulants for flip chip devices protect the chip/joint interface by redistributing thermal stresses stemming from CTE mismatches between the board and the die. The thermoset materials isolate the solder bumps from forces that might fracture the interconnects, adding to performance and reliability. The series is said to be a high-Tg, low-CTE liquid epoxy formulated for high flow speed under the chip. The rheology reportedly permits such flows to penetrate gaps of 0.001" on laminate, ceramic and flexible substrates.
Thermoset
Lord Chemical Products
Indianapolis, Ind.