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Burn-in Test Sockets
December 31, 1969 |Estimated reading time: Less than a minute
This family of burn-in test sockets for Direct Rambus (DR) memory devices will enable DRAM manufacturers to test devices that incorporate the memory management architecture developed by Rambus Inc., ensuring that they are fully tested and burned-in. The test sockets provide DR DRAM manufacturers a way to identify functional defects in singulated packages before assembly. They feature an open-top design for ease of use and are designed to accommodate the most popular IC package formats, including center-load bonded, next-generation packages, sized 0.8 x 1.0 mm; as well as edge-bonded, initial depopulated (72 I/O) packages, sized 0.75 x 0.75 mm.
Texas Instruments Inc.
Attleboro, Mass.