-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Flip Chip Bonding Service
December 31, 1969 |Estimated reading time: Less than a minute
To complement its turnkey electronics manufacturing, this company introduced a flip chip bonding service, featuring a fully automated Fuji flip chip bonder with a bonding force of up to 50 kg. The system`s high placement accuracy and units per hour are said to create an initial capacity of 200,000 pieces per month with a two-shift, five-day work week operation. This capacity can be expanded to 300,000 pieces per month by adding a third shift and additional equipment. As many flip chip substrates are also BGAs, the line will have full capability for advanced ball placement operations down to 0.5 mm pitch.
Express Manufacturing Inc.
Santa Ana, Calif.