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Flip Chip Wafer Bumper
December 31, 1969 |Estimated reading time: Less than a minute
This low-alpha-count flip chip bumping process is for both eutectic (Sn63/Pb37) and high-lead (Sn5/Pb95) solder bumps. The solder is processed with a measured alpha emission rate of 0.01 alphas per hour per cm2, said to be the lowest offered in the industry by a merchant wafer bumping provider. The process reportedly minimizes the potential for "soft errors" in ASIC and other microprocessor ICs with small gate dimensions (0.18 µm and below).
Unitive Electronics Inc.
Research Triangle Park, N.C.