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Wafer-bump Reflow System
December 31, 1969 |Estimated reading time: Less than a minute
This multi-belt, continuous-conduction, wafer-bump reflow system reportedly provides highly controlled and repeatable reflow profiles. The wafers are heated by conduction from a conveyor belt in the heating zones, with subsequent transfer to an independent cool belt in the cooling zones. Its low-particulate environment reportedly maintains an atmosphere at less than 5 ppm O2.
Radiant Technology Corp.
Fullerton, Calif.