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Dispensing Equipment
December 31, 1969 |Estimated reading time: Less than a minute
The Continuous-Flow piston pump for encapsulation materials is a high-throughput, positive-displacement pump with a repeatability said to be less than 1 percent. Its multi-piston design continuously feeds material with no recharge time. The Xyflex consists of four independently programmable heads that can reportedly dispense up to 140,000 dots per hour, depending on the application. This surface mount system dispenses solder paste, adhesives and conductive epoxies. The Pulse-Jet non-contact pump dispenses flux, alcohol and other low-viscosity fluids. Its variable pulse rate to 60 dots per second and adjustable dot size reportedly provide dot flexibility in dot size or line widths. The Automated Weight Calibration System calibrates the dispensing machine to minimize process setup and to remove process drift occurring with time, temperature and material variations. Finally, the Matrixx BGA sphere placement system reportedly provides 100 percent positive pin placement of solder spheres onto BGA substrates.
Speedline CAMALOT
Franklin, Mass.