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Tutorials
December 31, 1969 |Estimated reading time: 1 minute
Sixteen day-long tutorial sessions are planned to address the spectrum of electronics assembly, from the basics of SMT to advanced packaging materials. They will be held March 12 from 8:30 a.m. to 4:00 p.m.
Highlighting the APEX tutorials are:
- Surface Mount Technology: Principles and Practice - Ray Prasad, Prasad Consultancy Group, SMT Editorial Advisory Board member and columnist: Attendees will explore SMT design and manufacturing processes, materials and equipment, and the interdependency of design and manufacturing for higher yield, lower cost and faster time-to-market.
- Advanced Packaging Materials and Processes for BGA, Flip Chip, CSP and COB - Ken Gilleo, Cookson Electronics Group: This tutorial will present all types of nonconductive adhesives and encapsulants, focusing on advanced packages. Recent developments in screen printed dams, stenciled encapsulants and molded underfill will be included with cost/benefit comparisons.
- Chip Scale and Wafer-level Packaging Technologies for Semiconductors - Joe Fjelstad, Pacific Consultants LLC: A review will be given on the basic design, construction and performance aspects of CSPs that are now in the marketplace or under development. Emerging CSP standards, as well as innovative options in IC package design, including wafer-level packaging, will also be reviewed.
- Testing High-density SMT Circuit Boards Using ICT/MDA, Vision and Flying Probe - Robert Hanson, AmeriCom Test and SMT Technology: As the trend toward increased PCB complexity continues, there is a growing need to address testing issues earlier in the design process. Among the topics the session covers are proven concurrent engineering approaches to PCB design and layout steps that cut testing costs.