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Bonding System
December 31, 1969 |Estimated reading time: Less than a minute
The multi-use Model 860 Omni bonding system can be configured to bond flip chips as well as laser diodes and eutectic bonded die. The joystick-controlled system aligns and attaches die sizes from 0.006" square to 1" square at a throughput rate of up to 200 placements per hour with placement accuracy of ±5 µ. The basic platform is loaded with standard features such as an extend-retract cube beam splitter viewing system with illuminators and precision servo-motor- driven Z-motion with closed-loop temperature control. Bond loads of 5 g up to 10 kg are offered.
Semiconductor Equipment Corp.
Moorpark, Calif.