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Conference
December 31, 1969 |Estimated reading time: 1 minute
The conference kicks off February 27 and includes more than 100 sessions in the following tracks: design, assembly, HDI, inspection, management, packaging, test and contract manufacturing. The conference also features sessions on lead-free solder, including: Lead-free Soldering Options; Lead-free Soldering: Status and Technology Review; and Impact of Lead-free Solder on Global Manufacturing.
Design topics include: DFM for Cost- effective, Quality and Speedy Electronics Design, Manufacture and Assembly; Fine-pitch PCB Design for Manufacture and Assembly; Practical Methods to Design-in and Predict Surface Mount Attachment Reliability; Practical Design of Experiments for SMT/FPT/TH/Flip Chip; and Electronics Manufacturing DFM.
Assembly will cover: Lead-free Soldering Options; Scientific Hand Soldering in Touch-up and Rework; BGA/CSP Interconnection and Rework; Conductive Adhesives for Advanced Packaging and Reliability of BGA, Flip Chip and Chip Scale Assemblies.
The HDI track includes the topics: High-density Issues: Motherboard, Packaging/Cost Technology; Boundary Scan: The Logical Enhancement for Testing High-density Circuit Boards; Advanced SMT Manufacturing with High-density Components: Tips and Technology; and Microvia Technology: Processes, Applications and Economics.
The Inspection track will cover: Fundamentals of Machine Vision; Assessing the Inspection Alternative; Expanding Today`s BGA Inspection Capabilities; and Applying Machine Vision to the Electronics Industry.
Management topics include: Supply Chain Management; Optimizing Plant Availability for Lead-time Reduction; and Successfully Making the Transition to Chip Scale and Chip Size Packages.
The Packaging track covers topics including: Wafer-level Packaging: Principles and Practices; Flip Chip Technologies: Designs, Materials, Processes and Reliability; Wafer-level Packaging and Interconnection; and Flexible Circuit Technology for Modern Electronic Packaging.
Test covers the topics: Manufacturing Test in a High-mix, Low-volume Manufacturing Environment; Automated Board Handling at In-circuit and Functional Test; Built-in Self Test for Manufacturing and Support; and Testing SMT Circuit Boards Using ICT/MDA, Vision and Flying Probe Technology.
Contract Manufacturing includes the topics: Considerations in Outsourcing SMT to Contract Assembly; Economic Analysis and Selection of New SMT and Electronics Manufacturing and Test Equipment; and Buying or Building Today`s Automatic Testing Equipment.
"The NEPCON West 2000 curriculum provides practical, cutting-edge information and extensive training for every member of the manufacturing team, from design and assembly through test," said Cynthia Holloway, director of Industry Development, NEPCON.