Reading time ( words)
The KE 760 is an automatic, high-precision system for flexible surface mount assembly. The laser-aligned system can populate PCBs as large as 16 x 14" and incorporates a vision recognition system to detect missing or abnormal bumps on BGA packages. With a rated tact time of 0.32 seconds, the system reportedly achieves placement accuracy of ±0.002" for chips and ±0.001" for QFPs up to 2 x 2".
Juki Automation Systems Inc.