Chips and Large Parts


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The GSM platform with FlexJet technology allows high-speed placement of both chips and large parts on a single platform. The platform reportedly reduces machine downtime related to changeover because it handles both chips and ICs. Lines consisting of multiple machines with this platform and technology are said to achieve high machine utilization because of the range of components that can be handled.

Universal Instruments Corp.

Binghamton, N.Y.

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