-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Chips and Large Parts
December 31, 1969 |Estimated reading time: Less than a minute
The GSM platform with FlexJet technology allows high-speed placement of both chips and large parts on a single platform. The platform reportedly reduces machine downtime related to changeover because it handles both chips and ICs. Lines consisting of multiple machines with this platform and technology are said to achieve high machine utilization because of the range of components that can be handled.
Universal Instruments Corp.
Binghamton, N.Y.