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The benchtop ERSASCOPE 3000 inspection system offers a cross-sectional, nondestructive visual image of hidden solder joints by looking under BGAs, microBGAs and flip chip components, as well as interior fillets of PQFP and PLCC components. Its cross-sectional scope (90° angle of view) is complemented by a look-down scope (0° angle of view) with up to 350X magnification. The stand is said to allow for quick change of scopes with rotational and angled views (180° stepless). The holder for scopes, camera in the stand, and the X-Y table have course and micrometer adjustment.
Old Lyme, Conn.