Reading time ( words)
CE 3100 electrically conductive adhesive is a lead-free alternative to solder for SMD interconnection formation. It uses a proprietary oxide-reducing technology to reportedly provide electrical junction stability and reliability on common metal solderable surface finishes. The adhesive is said to cure completely in a typical solder eutectic reflow cycle; no post cure is needed. Because of this, it is compatible with existing SMT assembly processes. The adhesive`s low CTE results in good thermomechanical junction reliability vs. eutectic solder.
Emerson & Cuming