Component Specifier

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As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement require-ments. Modern manufacturing techniques are useless if a board's components are out of date, perform poorly or fail to satisfy end-user requirements. To assist manufacturers in this search, SMT Magazine presents Component Specifier, a new product section designed to spotlight state-of-the-art active, passive, odd-form and interconnect components.

Odd-FormDevices whose geometrical form factors are singular but not necessarily unique such that they must be manually mounted. Their housings (as opposed to their basic functions) are nonstandard as to shape. Examples include many transformers, hybrid circuit structures, fans/blowers, mechanical switching blocks, etc.

ActiveDevices capable by themselves of controlling voltages and currents to produce gain or switching actions in analog or digital circuits, i.e., reacting to an applied signal, they can change their basic charater.

PassiveDevices that do not change their character when electrical impulses are applied, i.e., they provide a single, repeatable reaction.

InterconnectDevices that provide mechanical and electrical union/disconnection and consist of mating plugs and receptacles (sockets) to join PCBs with cables, racks, chassis or other PCBs (stacking); actual connection to the board, however, must be via surface mount-type contacts.



Planar AntennaThe Splatch planar antenna, which uses a grounded-line technique to enhance the performance of a surface mount element, is now available in a model covering the 902 to 928 MHz band. Designed for direct PCB mounting, the component is suited for compact applications, such as remote controls, pagers and alert devices. The antenna measures 0.062 x 0.5 x 1.1", exhibiting characteristic impedance of 50 Ω and a VSWR of less than 1.9. The stable, grounded-line design is said to produce excellent pattern and polarization characteristics, and minimize detuning. Linx Technologies, Grants Pass, Ore.


Stacked CSPVertically mounting flash memory and SRAM onto a single package, this stacked, 8 x 10 mm CSP is designed for cellular phone, pager and other hand-held communications device applications. Manufactured using 0.25 μm flash process technology, the device is based on a standard I-pinout for flash densities up to 128 Mb. Outrigger bumps reportedly provide improved stability during board soldering, using as many as 72 bumps to connect the CSP to the PCB, with 0.8 mm pitch between bumps. Combinations offered include 16 Mb flash density/2 Mb SRAM and 32 Mb flash density/4 Mb SRAM. Flash Data Integrator (FDI) software, which integrates the functions of EEPROM, is also offered. Intel Corp., Santa Clara, Calif.

Line-matching TransformerThe LM308 surface mount line-matching transformer supports high-density Type II V.34 fax/modem PC cards. It is said to be suited for all V.32bis applications and almost all V.34 applications, as well as portable telecommunication devices, PCs and instrumentation. Height is 0.170" maximum, while offset configurations range from 0.006 to 0.096". Other features include 600 Ω nominal impedance with a 301 Ω load at the secondary; -76 dB maximum distortion level at 600 Hz, -10 dBm; 3.3 dB insertion loss ±0.25 dB at 1 kHz; and ±0.15 dB maximum frequency response at 300 Hz to 3.5 kHz. Datatronics Inc., Romoland, Calif.

Regulated DC/DC ConvertersThree new models offering 3.3 VDC output have been added to the company's line of 25 W DC/DC converters. The KW25-12S3.3-B2A provides 9 to 18 VDC input; the KW25-24S3.3-B2A provides 18 to 36 VDC input; and the KW25-48S3. 3-B2A provides 36 to 72 VDC input. Suited for I/O board system and subsystem distributed power configurations, the devices reportedly feature remote on/off, short circuit and overvoltage protection, line regulation of 0.2 percent and load regulation of 0.1 percent. They are housed in 2 x 2 x 0.45" packages. Polytron Devices Inc., Paterson, N.J.


Dome-lens LEDIntended for backlighting and light pipe applications, this 1105W Series surface mount, dome-lens LED measures 1.85 x 1.6 x 3.2 mm. It is available in red (660 nm), orange (605 nm), yellow (570 and 580 nm), green (560 nm), pure green (555 nm) and blue (430 nm), with typical luminous intensities up to 52 mcd with a 20 mA drive current. Features include a narrow viewing angle of 40° and reverse-angle mounting. The devices are available in 8 mm-wide tape on 180 mm reels. Stanley Electric Sales of America Inc., Irvine, Calif.


IC-style DC/DC ConvertersFeaturing a footprint of 1.64 cm2, NTV dual-output, 1 W DC/DC converters reportedly withstand I/O and O/O voltages of 3 kVDC maximum for a minimum of one minute. Based on IC-style lead-frame technology and transfer molding techniques, the devices are said to offer pin coplanarity of 0.1 mm in accordance with IEC191-6:1990 and compliance with CECC00802 for reflow soldering. Included in the series are converters with 5 or 12 V inputs and dual output options of 5, 9, 12 or 15 V. All are said to provide 1 W output across the -40 to 85°C temperature range without cooling. Supplied in UL 94V-0-rated plastic packaging, the devices have a five-pin configuration said to conform to industry-standard 22-pin formats. Tape-and-reel packaging is available. Newport Components Inc., Raleigh, N.C.


Low-voltage DC/DC ConvertersNew 10 and 15 A output, high-density, low-voltage DC/DC converters provide localized power conversion of an input voltage between 4.50 and 5.50 VDC into a controlled, single-voltage output specifiable between 1.30 and 3.50 VDC. They have a transient response of less than 10 μs. The MM5040 and M5050 Series DC/DC modules are said to offer lower output ripple voltage (100 mVP-P), tighter load/line regulation (±0.18 percent) and higher output voltage set-point accuracy (±0.75 percent) than standard voltage regulators. Microelectronic Modules Corp., New Berlin, Wis.

IR LED ArrayNew to the company's line of hybrid, surface mount components is the OPR5013L 13-element infrared LED array. This component is mechanically and spectrally matched to the company's phototransistor array, which makes the pair suitable for 13-bit absolute encoder applications. Each GaAIAs LED in the array is individually tested to ensure consistent and uniform output power. The opaque, polyimide package features an operating temperature range from -55° to 125°C and wrap-around, gold-plated mounting pads that are compatible with most reflow soldering processes. Optek Technology Inc., Carrollton, Texas.

Fully Integrated RF ModuleThe RF Oncore module is reportedly the GPS industry's first fully integrated RF module. Designed for a range of applications, it is said to reduce the potential layout, development and production problems associated with typical mixed-analog/digital designs. Measuring 24 x 40 x 10 mm, the module contains the entire RF section in one shielded and tested unit that provides the GPS down-conversion function. It includes an eight-pin connector for power, input and output, and a miniature MMCX RF connector for the antenna. Motorola Inc., Northbrook, Ill.



Capacitor ArrayThe W2A Series capacitor array packs four capacitive elements into an 0508 chip, saving board space and reducing assembly time. Available in an NP0 dielectric and X7R, the series offers the following capacitance values: 10, 33, 47 and 100 pF in NP0; and 0.01 and 0.10 μF in X7R. Intermediate values are also available. Applications include EMI filtering on I/O lines, DC blocking and decoupling. AVX Corp., Myrtle Beach, S.C.


Voice/Audio TransformersA line of surface mount voice/audio transformers is now available for telecommunications applications, including line cards, PBX equipment, telephone handsets and IP-based telephone systems. These transformers are designed for 600 or 900 Ω line impedance, with custom products available for two-wire/two-wire and two-wire/four-wire hybrids. Features are said to include low insertion loss and distortion with good return loss characteristics at frequencies as low as 200 Hz. The components can reportedly withstand convection and IR soldering temperatures of 235°C maximum. Pulse Engineering Inc., a Technitrol company, San Diego, Calif.


Wideband ChokeThe Series SMB 2.5 surface mount choke reportedly exhibits a wide operating bandwidth for EMI and RFI filtering applications. Offered in two impedance ranges, the parts are supplied on tape-and-reel for autoinsertion. Application-specific designs are accepted. API Delevan, East Aurora, N.Y.


Voltage Supervisor ICsAvailable in surface mount packaging as small as 2.1 x 2.0 mm, S-808 and S-809 voltage supervisor ICs are suited for use in CPUs, cellular telephones, pagers and PDAs. Features include power consumption ranging from 0.8 to 1.3 μA, detection voltage of ±2.0 percent, operating voltage of 0.7 to 10.0 V, and fixed detection voltage of 0.8 to 6.0 V in 0.1 V steps. The S-809 also has a built-in delay circuit to generate output delay time when connected to an external capacitor. The S-808 is offered in SC-82AB, TO-92, SOT-89-3 and SOT-23-5 packaging, while the S-809 is offered in the SOT-23-5. Seiko Instruments USA Inc., Torrance, Calif.

Thick-film Power ResistorsThe TL Series offers an extended power range of 45 to 225 W in values from 0.3 to 4 MΩ. Stock values are offered from 0.5 to 2,200 Ω in standard 10 percent tolerance. Housed in heat-shrinkable packages, the resistors are terminated in a modular form that combines high-temperature plastic insulators with metal springs for stable contact. Terminals are reportedly of the 0.25" quick-connect variety. High-temperature 300°C solder connects the terminals to the substrate. Ohmite Mfg. Co., Skokie, Ill.

Shielded InductorsThe PM42S Series ultra-low-profile, surface mount, shielded inductors come in a package measuring 2 mm maximum height and 4.7 mm square. They are suitable for applications such as PCMCIA cards, ultra-thin DC/DC converter modules, miniature wireless communication devices and hand-held instruments. With magnetic shielding designed to minimize RF radiation, they are available in inductances from 1.0 μ/1.72 A to 180 μ/0.14 A. Operating ambient temperature range is -40° to 85°C. J.W. Miller Magnetics, Gardena, Calif.

Integrated Passive DeviceThe PAC 560 GTL is a five-chip integrated passive device (IPD) solution that terminates 119 GTL lines. It is designed for socket 370-based processors in high-performance desktop systems. This solution is said to provide easy board routing, reduce board space and lower ownership costs in a 28-pin QSOP package. California Micro Devices Corp., Milpitas, Calif.

Programmable OscillatorsThe EP1400SJ and EP1500SJ plastic surface mount packages have been added to the EPO family of programmable oscillators. Housed in 9.8 x 14.0 x 4.7 mm J-lead packages, the 1400SJ is a 5.0 V device, while the 1500SJ offers 3.3 V for low-voltage applications. The series features custom or standard frequencies ranging from 1 to 125 MHz. Device performance options include tri-state or power-down function, ±50 or ±100 ppm frequency stability, and CMOS or TTL output. Ecliptek Corp., Costa Mesa, Calif.

Inverted Mesa CrystalsCIM-32 Series inverted mesa fundamental mode crystals are available in frequencies ranging from 51.84 Hz to 155.52 MHz. Features are said to include low resistance, high pullability, and good unit-to-unit and lot-to-lot repeatability. The devices are packaged in an industry-standard HC-45 package for SMT or through-hole mounting. Applications include precision high-speed clocks, VCXOs and VCTCXOs. Champion Technologies Inc., Franklin Park, Ill.


Microminiature Ceramic CrystalAt 1.1 mm maximum height, the FD microminiature ceramic SMD crystal is suited for use in notebook computers, pocket LAN adapters, PC cards, disk drives and other applications requiring high-reliability frequency control in limited space. The 7.5 x 5 mm device offers a frequency range of 9.8 to 160 MHz; a frequency tolerance of ±50 ppm; a frequency stability of ±50 ppm; and an operating temperature of -10° to 60°C. The crystal is also available with tolerance and stability of 10 ppm for telecommunications and similar applications. Fox Electronics, Fort Myers, Fla.

Ovenized OscillatorThe Model 119 OCXO is an ovenized oscillator designed to offer phase-noise and frequency stability. It is suitable for wireless base-station applications, including GSM, TDMA and CDMA protocols. A voltage control input provides for phase-locked control of the oscillator as a slave to primary timing reference sources. It is also useful as a reference in frequency synthesis applications where low phase noise is important. The maximum phase noise specification is -150 dBc/Hz at 100 Hz, and -160 dBc/Hz at the 10 kHz intercept. CTS Reeves Frequency Products, CTS Corp., Elkhart, Ind.

Ceramic Surface Mount OscillatorsThe B13 and B14 are ceramic surface mount oscillators that are designed to offer frequency stability as tight as 10 ppm inclusive from 0° to 70°C. They are said to be suitable for wireless communications applications that demand tighter stability over a varied temperature range. The oscillators measure 5 x 7 x 1.4 mm and are available in frequencies ranging from 1,000 to 100,000 MHz. The series comes in either 3.3 or 5.0 VDC; typical input currents run at less than 50 mA. Bomar Crystal Co., Middlesex, N.J.



Shielded Mini-DINEngineered with a slimmer design than previous versions, the KMDT right-angle mini-DIN connector is geared toward the audio, video, portable computer and digital equipment markets. Its body is made of high-temperature thermoplastic for reflow soldering processes, and the shield is tin-plated phosphor bronze. A front shield also helps minimize radiated noise problems. Leads are said to be true surface mount design, while contacts are gold plated with a crimped design for retention strength. Both four- and six-contact counts are available. Kycon Inc., San Jose, Calif.

ZIF ConnectorsFPC-terminating FH17 Series ZIF connectors reportedly protrude 1.3 mm above the board-mounting surface. The hinged actuator's Flip-Lock design is said to allow termination of the FPC with a single finger motion. With 0.5 mm contact spacing, the connectors are available in 10, 20, 24 and 30 positions. They are also offered in packaging suited to high-volume board placement with automated equipment. Hirose Electric (U.S.A.) Inc., Simi Valley, Calif.

Telephone Interconnect TransformerEngineered for use with automated pick-and-place assembly equipment, the SPT-044 telephone interconnect transformer features gull-wing leads and compact package dimensions. Impedance ratio is 600 Ω split: 600 Ω split, with a high potential rating of 1,500 Vrms. Maximum dimen-sions are 0.410 x 0.520 x 0.650". Designed for dry circuits, the component can reportedly be used in voice as well as V.32 data applications. Prem Magnetics Inc., McHenry, Ill.



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