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New Products
December 31, 1969 |Estimated reading time: 22 minutes
Chip Scale Test ContactorThe HP 95000 chip scale, auto-test contactor is designed for use with the HP 95000 tester. The contactor works with the tester to provide 1 GHz performance with less than 1 ns pulse widths for testing direct rambus DRAM. The contacts use 0.75 mm pitch, 1.3 to 1.6 nH self inductance, 0.02 to 0.09 capacitance and 9.3 GHz bandwidth at 1.0 dB for test results from -55 to 150°C with a typical life cycle of more than 100,000 insertions. OZ TEK, Hayward, Calif.
CSP PlacementThe CSPBlaster placement machine has 300 8 mm feeder inputs, a component range up to 44 mm (tape-and-reel), the capability to place microchips as small as 0201s and handles boards up to 18 x 24". It features a camera arrangement with a unique horizontal lighting system that illuminates the solder bumps, but not the background reportedly increasing the accuracy of the machine's vision recognition systems. This system also offers cut bump and missing bump detection, as well as the ability to detect the perimeter of the component or all solder bumps. Panasonic Factory Automation Co., Panasert Group, Franklin Park, Ill.
SMT FusesThe Polyswitch line of surface mount resettable fuses has expanded with 21 new products. The new fuses double the size of the polymeric positive temperature coefficient (PPTC) surface mount device product line. Reportedly, these devices collectively represent considerable improvements in size, hold current range, resistance and time-to-trip. They are also said to meet current and emerging industry needs for smaller, more reliable, cost-effective components. Raychem Corp., Menlo Park, Calif.
Totes and BinsThe Olympic tote box line is said to provide solutions for the electronics industry, offering totes, bins, and accessories to address small parts storage and organization. The products are available in Bentron conductive, Benstat static dissipate and natural gray polypropylene materials. InterMetro Industries Corp., Wilkes-Barre, Pa.
Electrically Conductive EpoxyLoctite 3882 is an electrically conductive epoxy adhesive for electronic interconnect applications. It is said to be designed to replace solder in high-flexibility applications where stress cracking is a problem, such as on flex and flex on glass. This single-component, silver-filled epoxy is room temperature or heat curable and can be dispensed via syringe or stencil/screen printed. Electrically and thermally conductive, it can develop bonds between materials including metals, ceramics, glass, laminates and molded plastics. Loctite Corp., Rocky Hill, Conn.
In-line CleaningThe Hydrojet in-line cleaning system is available in Mach I, II or III models. It is said to employ flow dynamics technology that allows cleaning applications to be accomplished in half the footprint (16') and twice the speed of other in-line cleaners. The system reportedly cleans high-density assemblies at speeds up to 6 to 8' per minute. The system consists of a pre-wash stage, wash, chemical isolation, three rinse stages and drying. The wash chamber includes an optional pre-wash and three-stage spray manifold designed for high-speed cleaning. The chemical isolation between wash and rinse includes an optional blower. Austin American Technology Corp., Austin, Texas.
ADHESIVES/EPOXIES
Flip Chip UnderfillThe E/U/1398 series is pre-deposited as a liquid epoxy and reportedly acts as a flux for the solder reflow process. The underfill then cures to act as an epoxy encapsulant. Because it is pre-deposited, it is said to fill the gap comprehensively, giving greater protection. Multicore Solders, Richardson, Texas.
High-temperature EpoxyAremco-Bond 526N is a high-temperature epoxy system used to bond ceramic feed-throughs used in electrical and electronic industrial applications to 570°F. It is an unfilled, 100 percent solids, 1:1 mix ratio epoxy system. Flexural and tensile strengths are 16,000 and 2,800 psi, respectively. The volume resistivity is 4.0 x 1014 Ω cm; dielectric strength is 450 V per mil; and the dielectric constant is 3.01 at 1.0 Hz. The total mass loss at 125°C is 0.94 and collected volatiles condensable at 25°C is 0.00. It has a mixed viscosity of 4,000 cps and pot life of 2.5 hours. The epoxy is fully cured after setting at 325°F for two to four hours. The cured Shore-D hardness is 89 and shrinkage is less than 0.01" per inch. It is supplied in pre-filled 50 ml dispense cartridges as well as pint, quart and gallon containers. Aremco Products Inc., Valley Cottage, N.Y.
Solventless ResinDolphon CC-1157 is a solventless resin that reportedly cures to a flexible, resilient film that suppresses noise and resists cracking. The coating is said to provide resistance to moisture and corrosion. Its higher viscosity and thixotropic consistency reportedly allow better impregnation and retention. It meets most environmental limits for emission generation. John C. Dolph Co., Edison, N.J.
UV-curable AdhesiveThe MRC 01-1169 single-component, UV-curable adhesive is for fiber optic applications where flexible glass or glass to stainless-steel bonds are required. It was designed for sealing applications in gain flattening filters used in fiber optic repeaters. Merco Technologies Group Co. Inc., West Warwick, R.I.
Optical AdhesiveThe flexible optical adhesive UVA3155 was developed for coupling optical parts with more than 1,000 psi bond strength and greater than 99 percent transmission. The flexibility of the adhesive reportedly allows bonding of large parts and parts with different CTE without inducing shear or tensile stresses. It has a refractive index of 1.54 and retains flexibility at -65°C. Depending on thickness, the adhesive can be cured with medium UV intensity between 1 to 5 seconds and has more than 12 months of ambient storage stability. AI Technology Inc., Princeton Junction, N.J.
ASSEMBLY EQUIPMENT
PCB Transport SystemThe SIPLACE Productivity Lift is a PCB transport system that reportedly allows manufacturers to arrange placement machines in a traditional in-line configuration while obtaining the benefits of parallel line manufacturing. The system is said to increase throughput by reducing the impact of secondary times on the PCB production process. Reportedly, transfer time reduction results in a through-put increase ranging from 15 to 125 percent, depending on the PCB application. Siemens Energy & Automation Inc., Electronics Assembly Equipment, Norcross, Ga.
Automated Transfer ConveyorsThese automated transfer conveying systems have zone-buffered product accumulation areas in Class 1 cleanroom enclosures. With product rotators (pneumatic or electric) programmed to transfer components entering, leaving and in holding zones, these conveyor systems provide a method of moving and accumulating product components while protecting them from physical contact between carriers and environmental contamination. Quickdraw Conveyor Systems, Burnsville, Minn.
Assembly Line RotatorThe Model LR1000 I/O is a flexible, automated assembly line rotator that can handle PCBs and substrates up to 12" in length. The system has two standard models: the LR1000-I combines lines (three in one out) and LR1000-0 separates lines (one in three out); both operate in multiple configurations. They have a stand-alone PLC with SMEMA interface, removable safety covers for access and a footprint of 17.25" wide by 22.5" deep. Martek Automation, San Marcos, Calif.
PCB Transport RacksThese stackable PCB transport and storage racks are made of antistatic material for the handling of PCBs during assembly. The racks are available in a variety of models. They handle board sizes of 12.9" deep and can be ad-justed from 3.2 to 9.8" wide. Storage capacity for these racks is from 25 to 100 PCBs. Model F9003 is for use in a TDK inserter and will handle PCBs of 18.1 x 12.9" (5.9 x 3.9" minimum). FKN Systek Inc., Waltham, Mass.
Board DepanelerThe T-MD2 board depaneler has three titanium blades in a tongue-and-groove design that reportedly eliminates the stress to boards normally caused by hand-breaking. This motorless depaneler has a board holder/balance guide that does not require setup for each individual board. It depanels any pre-scored PCB material from 0.6 to 1.6 mm thick. This depaneler requires no power or shop air. Manncorp, Huntingdon Valley, Pa.
Final Assembly CellThe HiSAC 1500 FA is a final assembly cell that can perform an array of final assembly functions. These functions range from labeling and screw driving to component calibration. The cell can be reconfigured for product changeovers. A dedicated servo gripper is used to pick up an array of different assembly components. This is combined with an automatic tooling mechanism that allows an equally wide range of different shapes to be accommodated. This arrangement also has a quick-change vacuum pick-up system. All versions of the cell include a screwdriver capability. The cell uses a feeder interface that reportedly can accept components supplied in formats from tray to GPAX, tube or special feeders. PMJ automec USA Inc., Grand Prairie, Texas.
Solder Pallet CartsThese carts store pallets horizontally, with a built-in indexing system to make certain the pallets are level. Pallets can be pre-staged with boards and components on them before wave soldering. It is said to be designed to minimize vibration so loose components do not vibrate out of position. Hot pallets can be supported by steel runners. The carts are ESD safe and have standard drag chains. The carts are available in two sizes, 30 and 60", with adjustable end panels. Optional double-sided panels can be added to increase capacity. Bliss Industries Inc., Fremont, Calif.
Vibration Isolation WorkstationThe 9102 QC Series vibration isolation workstations feature a table with 48" high plexiglass enclosure with double, front-opening doors. A heavy-duty work surface has been incorporated into the design that lowers the center of gravity and provides the inertia to help isolate instrumentation from the shock and vibration associated with industrial environments. The workstation has a 1,300 lb capacity and a standing work surface height of 36". A work shelf is included inside the enclosure above the floating surface for mounting peripheral equipment or transcribing data. The workstation is available in three sizes: 30 x 36", 30 x 48" and 30 x 60". Kinetic Systems Inc., Boston, Mass.
Lifter/TransporterThe Shop ELPH lifter/transporter achieves lift with a linear actuator. Four oversized swivel casters reportedly roll easily on any surface, over threshold, and in and out of elevators. A swivel lock allows for omni-directional or straight-line movement. Its 24 V battery pack provides enough power for 100 lifts without recharging. An internal charger with a 10' cord will fully charge the battery in four hours. The units are available in two capacities 300 and 500 lb. Both units have a lowered height of 13.5" and a maximum raised height of 32.5". Southworth Products Corp., Portland, Maine.
Straddle-mount Assembly ToolThe straddle-mount assembly tool reportedly automatically inserts side-mounted plugs and receptacles on PCBs. The tool picks the component, checks its polarity with vision, orients it and mounts it with leads straddling both sides of the PCB. Universal Instruments, Binghamton, N.Y.
CLEANING MATERIALS/EQUIPMENT
Aqueous Photoresist StripperThe ADF-30 all-purpose aqueous photoresist stripper removes resist from fine lines and spaces, and contains brightening agents for AOI and improved etching. It is said to provide fast strip speed and produces filterable particles for a prolonged bath life. It contains no glycol ethers and is reportedly effective in both spray and soak. RBP Chemical Corp., Milwaukee, Wis.
Hand CleanerThese pop-up, presaturated wiping cloths are designed to clean solder from SMT manufacturing work surfaces, screens, stencils, tools and fixtures as well as hands that touched soldered PCBs and assemblies. CFC- and HCFC-free, the cleaner is said to be fast drying, pleasant-scented and leaves no residue. Amtech, Branford, Conn.
Reflow and Cleaning SystemThe MicroPro integrates the reflow and cleaning processes, and provides fully automated processing of singulated parts in boats, trays, and other carriers in addition to individual strips and arrays containing multiple parts. The system integrates reflow and cleaning of BGA packages. Reflow is performed in a thermal control section, and the cleaning section removes flux residue traces with wash, rinse and dry steps. Incoming parts automatically advance through all process steps, with their solder spheres contacted by only the liquid and gaseous cleaning agents. Its transport system reportedly maintains part orientation and processing regardless of the direction of travel. Speedline Technologies Inc., Franklin, Mass.
Modular Cleaning SystemThe Benchmark Series aqueous and semiaqueous modular cleaning system can incorporate virtually any combination of ultrasonic frequencies, cleaning tanks, rinsing tanks and drying modules. These systems are not preconfigured. Systems incorporate standard tank sizes from 12 x 16" to 20 x 32". Branson Ultrasonics Corp., Danbury, Conn.
Chemical StripperCrystalbond 509-S can be used to remove polymer coatings and inorganic particulates from hard surfaces and microscopic hard-to-reach areas. It is formulated using a solvent/surfactant system characterized by a neutral pH, nonionic chemistry that is reported to be non-reactive with even the most reactive metals. It can be used in a warm cleaning process such as ultrasonic agitation or spray washing. After removing the polymer, the part can be rinsed with a dilute nonionic surfactant such as liquid detergent and then rinsed with warm deionized water. Aremco Products Inc., Ossining, N.Y.
COATING/DISPENSING EQUIPMENT
Hand PlungerThe hand plunger is for manual dispensing applications. It accommodates the company's standard line of 3, 5, 10 and 30 cc syringes and dispenses adhesive materials without requiring an air supply. Made from polypropylene and Delrin, the plunger is a one-piece unit designed for repeated use. Syringes can be fitted with the company's proprietary drip-free stoppers and family of needles and tips to suit specific applications. Fishman Corp., Hopkinton, Mass.
Non-contact Dispensing PlatformThe M2000-SMT is a non-contact dispensing platform for PCB assembly. With patented DispenseJet technology, the system is said to offer speed and accuracy for high-volume PCB manufacturers requiring delivery of surface mount adhesive. The system reportedly dispenses adhesive at rates exceeding 40,000 dots per hour and is capable of cycling every 12 milliseconds to support the demands of high-volume, in-line production. The valve shoots dots from 1 to 3.5 mm above the board to optimize delivery of surface mount adhesives without impacting the PCB. Asymtek, a Div. of Nordson Corp., Carlsbad, Calif.
Dispensing SystemsThe System 230/240 cyanoacrylate dispensing systems can be operated in timed or manual mode. The systems are designed to accurately and precisely dispense a variety of cyanoacrylate materials. It is available in hand-held and fixtured models. Kahnetics LLC Co., Bloomington, Calif.
Hand-held Dispensing SystemThe MIXPAC hand-held adhesive dispensing system for two-component adhesives consists of a manual or pneumatic dispensing gun, a cartridge and a static mixer. The system reportedly increases the user's choice of adhesives for any application by making two-component adhesives as easy to use as a single-component adhesive. Two-component chemistry can be tailored for a specific purpose. ConPro Tec Inc., Salem, N.H.
HARDWARE/ACCESSORIES
PCB RetainersThis new line of spring-lock, zero-insertion-force PCB retainers are for PCB mounting. The retainers reportedly furnish an effective thermal interface between the PCB and the dissipating card cage cold-wall, allowing for the even distribution of heat. Their locking lever presents an immediate and clear visual indication of the locking status. The retainers are manufactured from precision cold-rolled steel and have a gold-zinc finish. They are available in 3, 4 and 6" lengths. CTS Corp., Elkhart, Ind.
Display SocketsThe 800 Vertisockets horizontal and vertical display sockets are available with an extended temperature range, allowing the gold-plated sockets to withstand operating temperatures of up to 257°F (125°C) and IR/reflow SMT solder temperatures. The sockets are for use with LEDs, incandescent lamps, DIP switches and other DIP devices. They are available with bifurcated or collet contacts. The bifurcated pin counts range from 8 through 48 pins on centers ranging from 0.200 through 0.600". The sockets allow DIP devices to be mounted at a 90° angle to the PCB. The contact pin material is Grade A spring-tempered phosphor bronze per QQ-B-750 and is offered in either 90/10 tin/lead (200 μ) or gold (10 μ) plating over nickel (50 μ). The body material is UL 94V-0 glass filled 4/6 nylon. The collet sockets are available in pin counts of 6 through 48 pins on centers ranging from 0.300 through 0.600" centers. The contact material is beryllium-copper alloy per UNS C17200 and is offered in gold (30 μ) over nickel (50 μ) plating. The body material is UL 94V-0 glass-filled nylon. Aries Electronics Inc., Frenchtown, N.J.
INSPECTION EQUIPMENT
Verification SystemThe DMx Verifier+ is a system that reportedly allows users applying 2-D bar codes to verify in real time that direct part marks or labels have been properly applied and are readable. The system includes a frame grabber CD-ROM-based software for reading and grading codes. The software can be used in conjunction with the company's hand-held symbology reader. Other components available include camera kits, lighting and fixtures for reading direct part marks. RVSI, Canton, Mass.
Frame GrabberThe MVS-8100C is an acquisition-specific PCI frame grabber for acquiring and displaying images in color. The system has real-time image transfer to the host PC for analysis in full RGB color. For color applications, images can be acquired using a single RGB camera or two multiplexed RGB cameras. For monochrome applications, the board can support up to four multiplexed RS-170 cameras. It can also be used to perform simultaneous acquisition from two RS-170 cameras. Cognex Corp., Natick, Mass.
PCBs/SUBSTRATES/LAMINATES
Insulated Metal SubstrateThe Thermal Clad HTV is a high-performance insulated metal substrate that is said to solve thermal management problems associated with shrinking packages and increasingly hostile environments. Reportedly, it provides the highest operating temperature and voltage parameters available in an insulated metal substrate. It is said to be suitable for high-voltage power supplies, off-line switching power suppliers, motor drives, solid state relays, industrial lighting, automotive under-hood applications and others. The Bergquist Co., Edina, Minn.
Polyster CircuitIntelliflex is reported to be a thin, flexible polyester circuit with active components that can be substituted for rigid PCBs. Initial environmental testing has shown that the electrical properties are stable under heat and humidity, as well as under corrosive environments such as sulfur. The product incorporates proprietary silver conductive inks that are said to have reduced silver migration, when compared to commercial inks, when tested under 85°C at 85 percent RH. It uses a conductive epoxy to adhere components in the circuit. The product is lead-free. Xymox Technologies Inc., Milwaukee, Wis.
SubstrateThe ViperBGA is a solution for electrical and thermal performance and is reportedly ideal for applications requiring high pin counts and high-density routing. The cavity-down substrate allows for heat dissipation through an integral copper heat sink directly attached to the IC. The substrate employs a micro-filled via process to make connections between multiple signal, power and ground planes in the substrate. ASAT Inc., Fremont, Calif.
PICK-AND-PLACE
Component HandlerThe MP-410 tray-to-tape/tray-to-tray machine is said to feature true 3-D coplanarity bump inspection, minimal tooling requirements and a compact footprint. It has two independent heads on linear motors. It can handle a variety of BGAs, μBGAs, CSPs, QFPs and PLCCs from standard JEDEC trays. This component handler can output to tape at 5,000 parts per hour and to tray at 4,000 parts per hours. The vision system inspects components for 3-D coplanarity, mark and orientation. Once inspected, mark and bump rejects are sorted into two separate trays. The servo-driven taping module performs hot and cold sealing of PSA tapes. With tooling changeover, the system accepts a range of tape widths from 8 to 56 mm. A computer-based control system incorporates pull-down menus and a graphical user interface. The control monitors the production processes. Ismeca USA Inc., Vista, Calif.
Tool KitWith the new Exchangeable Tool Kit, the company's HYDRA Speedmount picks at reported speeds of 14,400 CPH from 8 mm tape. When picking from 12 and 16 mm tape, four components are picked at a time, reaching a maximum placement speed of 10,000 CPH. The tool kit allows the pick-and-place machine to pick a wider range of components. MYDATA Automation, Peabody, Mass.
SOFTWARE
Storage and Transmission The VIA-S200 Windows-based software is designed for storing images and transmitting them over the Internet or LAN, measuring samples, annotating details, creating comparison templates, or recording a series of measurements for use in other applications to make reports, charts, spreadsheets and presentations. It is designed to grab an image using a frame grabber or a TWAIN-compatible device, such as a digital camera or scanner. The software can also operate without a frame grabber, camera or a scanner when images are created and displayed on screen with another application. Images can be transmitted with the measurement and marker overlays, text and voice information to another computer for review, inspection, examination or comparison. Boeckeler Instruments Inc., Tucson, Ariz.
Data ExchangeThe DEX Center is a server-based system providing an exchange of data via the Internet/intranet. The data is chronicled, stored and managed. Users can tell what data was sent to or received from any customer or supplier. The center reportedly eliminates delays associated with data exchange and transmission problems. ITI, Milford, Ohio.
PCB AnalyzerThe PCB Analyzer is a shareware option for the CAMCAD Professional product line. It is designed to review layout data created by CAD systems. After a design is loaded into the design software, the analyzing software allows the user to query, select, highlight and cross select components and nets by attributes and names. A NetFollow command allows two nets graphics (routes) to be followed simultaneously through the PCB design in a user-definable highlight color. Queries can be made for tooling holes, test points and other component classifications. Router Solutions Inc., Newport Beach, Calif.
PCB AssemblyGC-PLACE 4.1 for Windows can import the DXF drawing format. Manufacturing Rules Check performs soldermask checks to ensure part clearance. Fill and Fix polygon commands reportedly make working with odd-shaped polygons easier, as well as enhancing stencil preparation and documentation. GrapiCode, Mountlake Terrace, Wash.
Analysis SystemActiVEMC v1.2 analysis system was designed for existing users of PADS PowerPCB and OrCAD Layout. Working from native ASCII PCB formats, the software uses timing-driven PCB placement capabilities to prove pre-layout analysis of electrical integrity problems. Premier EDA Solutions Ltd., Chestnut, U.K.
Flip Chip SupportPowerBGA 3.0 provides new flip chip design tools, support for design reuse methodologies with a new physical design reuse module and expanded constraint-driven design capabilities. This new version of the software reportedly includes enhancements to intelligent attribute definition and control, extended API commands, and keepouts and cutouts. Intelligent attribute definition and control is said to allow users to leverage data from many sources. Attributes can be defined and checked as measurements, full integers, decimals, text strings, dollar amounts and binary numbers. Intelligence can be added for arithmetic functions, wild cards and minimum/maximum value verification, and also assign attributes at the schematic, library or board level. API commands allow for OLE automation. Keepouts and cutouts allow definition of mechanical keep-out areas and attributes defined in CAD programs to be legible to the software. PADS Software Inc., Marlborough, Mass.
Defect MonitoringQuality System 2.0 reportedly provides real-time defect information for monitoring PCB assembly and box-build production equipment and product. Features of this latest upgrade reportedly include real-time reports issued within seconds, user-defined alarms triggered when errors exceed established parameters, and alarm confirmations that track and log response and resolution time. The genealogy/box-build tracks relationships between assemblies. Assemblies are defined and joined with higher level assemblies until a complete product is defined. Information for each component in a final assembly is logged for retrieval. Unicam Software Inc., Portsmouth, N.H.
X-ray Database and InterfaceThe E7216A database software and the E7217A component object model interface enable open access for the HP 5DX series of automated X-ray inspection systems. The database software reportedly allows manufacturers to construct quality process software solutions, ranging from a simple spreadsheet application providing various SPC views to more elaborate enterprise-wide quality-control systems. The software packages its real-time results in a Microsoft Access database format. A published schema for the defect and measurement data, included with the software, allows access to the results. The interface provides programmatic access to the X-ray's defect measurement data. Hewlett Packard, Palo Alto, Calif.
Curing Oven AutomationAuto Ramp Control software for the MicroCure line of variable frequency microwave curing ovens automatically regulates the temperature throughout a process cycle. The software reportedly provides profiling and process-cycle control independent of the type of load or number of parts inside the oven chamber. Ramp rate, target temperature and hold/soak time can be programmed in one step. Lambda Technologies, Morrisville, N.C.
Conformal Coating Systems ProgrammingEasy Coat for Windows is a software package reportedly designed to enhance programming power and flexibility for Nordson Century selective conformal-coating systems. The software is a Windows NT application. The system stores conformal-coating system activity, and a log file enables the user to review records of start-up, run time, average cycle time and other critical production data. This information is configurable to allow adjustments of periodic function, including time, purge time and cleaning brush time. The programmer can set report parameters. Nordson Electronics Systems Group, Amherst, Ohio.
SOLDERING MATERIALS
Solder SpheresSolder spheres for BGA packages are available in a range of sizes from 0.0118 to 0.0500". The spheres are reported to have accurate diameters; bright, shiny surface finishes; and highly spherical shapes. Indium Corp. of America, Utica, N.Y.
Lead-free, No-clean Solder PasteThe F369Cu0.5-89M3 solder paste is designed to replace 63/37 or 62/36/2 lead-bearing solders. It reportedly has a no-clean flux developed specifically for use with lead-free alloys to minimize defects and improve wetting by 100 percent over existing systems. The solder paste is designed to work with existing equipment. It has an eight-hour tack and work life, and complies with Bellcore and J-STD-004 requirements for no-clean pastes. This paste consists of fully alloyed metal powders, binders, solvents and thixotropic agents for surface mount assembly applications. It can be reflowed in air or nitrogen. Packaging options include ProFlow cartridges; 5, 10 and 30 cc syringes; 250, 500 and 1,000 g jars; as well as 3, 6 and 12 oz cartridges. Heraeus, West Conshohocken, Pa.
STATIC CONTROL PRODUCTS
Air IonizerThe Model 960 mini air ionizer is said to provide pinpoint coverage at locations such as the typical ESD workstation, inside or on top of production equipment, inside OEM equipment, pick-and-place, and tape-and-reel equipment. It generates a flow of ionized air particles that neutralize any stray electrostatic buildup on a surface. Features of the ionizer include a steady-state DC ion emission for efficient ion delivery, and intrinsically balanced shielded emitter points with no adjustment necessary. The blower size is 3 x 4 x 2" and includes the fan assembly, L-shaped mounting bracket/stand and power cable. It uses 24 VAC power. 3M Electronic Handling and Protection Div., Austin, Texas.
Static-dissipative Floor FinishThe #4200 STATICIDE zero-VOC floor finish reportedly emits no harmful or dangerous vapors in the air during the application or maintenance process. This product is biodegradable, abrasion resistant and contains no dye or fragrance. It is available double-bagged for cleanroom packaging. ACL Inc., Elk Grove Village, Ill.
Polymer AlloysThe Stat-Rite S-Series polymer alloys are said to produce rapid, consistent and predictable static-decay times as the result of a surface-resistivity level that remains intact from the polymerization stage through compounding and processing, whether thermoformed, injection molded or extruded. The polymer has a surface resistance of 108 Ω. The alloys demonstrate static decay times of below 0.1 seconds (from 1,000 V). These polymer alloys reportedly exhibit lower ionics, lower off-gassing and lower tribocharging than previous alloys. BFGoodrich Performance Materials, Cleveland, Ohio.
FlooringLOGIC Tile is reportedly an environmentally friendly, low-ouTgassing static-dissipative and conductive tile flooring. This product is available in 11 colors and in tile sizes of 12 x 12", 24 x 24" and 36 x 36" (all 1/8" gauge). The flooring is offered in two standard electrical resistance levels. The conductive vinyl tile meets the requirements of NFPA 99 and ASTM F150 with an electrical resistance of 2.5 x 104 to 1.0 x 106. Under the same requirements, the static-dissipative vinyl tile has an average point to ground electrical resistance of 1.0 x 106 to 1.0 x108. Both of these products conform to standards set by ESD S7.1 Resistive Characterization of Materials. Both tiles reportedly keep body voltage generation at minimum levels. Marley Flexco, Tuscumbia, Ala.
Verification KitThe Periodic Verification Kit performs electrostatic measurements requiring a portable charge plate monitor. The kit consists of a periodic test meter, 1,200 V dual polarity charger, a 1 x 2.5" test plate, a 6 x 6" test plate, cable and tripod. The kit can perform tests such as ionizer discharge time, ion balance, static propensity, triboelectric charge analysis, static dissipation and voltage suppression. The test plate attaches to the front of the test meter. When installed, the sensitivity of the measurement system is said to increase by a factor of 10. It can be used to measure voltage generated by ionizer imbalance, static propensity, or charge and polarity of any object placed onto the charged plate. The 6 x 6" test plate attaches to the smaller test plate. The complete system is housed in a carrying case measuring 12 x 8 x 4". SIMCO, Hatfield, Pa.