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These images of SMT defects and attributes were compiled by consultant Tom Clifford. In Section 4, we showcase copper splash, over-etched and thin traces, solder on copper, and other defects. Some of these can cause electrical shorts.
These images of SMT defects and attributes provide resources for training, quality control specs and standards, and research. The complete Section 4 image library appears below. Other Sections, published and upcoming, are listed below the gallery. Descriptions, provided below each image, do not necessarily define causality or severity, but serve only as identification.
Figure 1. Copper splash and poke-through. Figure 2. Cratered pad, and over-etched, thinned trace. Figure 3. Annular ring violation.
Figure 4. Poke-thru, solder on copper, on connecting trace.
Figure 5. Manual attempt to isolate pad from via. Figure 6. Poke-thru. Likely to cause electrical short.
Figure 7. Poke-thrus and possible loose copper debris. Figure 8. Over-etched, thin connecting trace.
(Upcoming)Section 5. BGA PCB Defects, MaskSection 6. BGA PCB Defects, Metallic ContaminationSection 7. BGA PCB Defects, Non-metallic Contamination, FOD Section 8. BGA PWB-related Assy DefectsSection 9. BGA Assy X-sectionsSection 10. BGAs Re-balled Section 11. SMT Assy DefectsSection 12. SMT Assys, T-cycled CracksSection 13. SMT PWB PadsSection 14. PWB Vias, X-sections
Do you have images of solder-joint or other interconnect features or defects that you would want to share? Send them to Holly Collins at SMT, firstname.lastname@example.org. You must obtain permission to publish the photos and may not show proprietary or company-specific information on the images. We are particularly interested in images of advanced SMT assembly technologies and failure analyses.