-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Section 12: SMT Assemblies, T-Cycled Cracks
August 18, 2010 |Estimated reading time: 1 minute
These images of SMT defects and attributes were compiled by consultant Tom Clifford. Section 12 includes images of non-collapsing BGA balls, CGAs, LCCCs, SMCs, gull-wings, x-sections and more.
These images of SMT defects and attributes provide resources for training, quality control specs and standards and research. Other Sections, published and upcoming, are listed below the gallery. Descriptions, provided below each image, do not necessarily define causality or severity, but serve only as identification.Figure 1: Ceramic column grid array (CGA), NTK style, t-cycled to failure.Figure 2: Ceramic BGA non-collapsing ball, t-cycled to failure.Figure 3: Leadless ceramic chip carrier (LCCC), t-cycled to failure.Figure 4: Ceramic column grid array (CGA), IBM style, t-cycled to failure.Figure 5: SMR, t-cycled to failure.Figure 6: SMR, t-cycled to failure.Figure 7: SMR, t-cycled to failure.Figure 8: SMR, t-cycled to failure.Figure 9: MELF, t-cycled to failure.Figure 10: SMC, t-cycled to failure.Figure 11: Gull-wing, toe, t-cycled to failure.Figure 12: Gull-wing, toe, t-cycled to failure.Figure 13: SMC, t-cycled to failure.Figure 14: X-section, SMR t-cycled to failure.Figure 15: X-section, SMR, t-cycled to failure.Figure 16: X-section, SMC, t-cycled to failure.
Section 1: BGA PCB Defects, Plating
Section 2: BGA PCB Defects, External Damage
Section 3: BGA PCB Defects, Via-in-Pad
Section 4: BGA PCB Defects, Dimensions, Poke-Thru
Section 5: BGA PCB Defects, Mask
Section 6: BGA PCB Defects, Metallic Contamination
Section 7: BGA Pads--Non-Metallic ContaminationSection 8: BGA PWB-Related Assembly DefectsSection 9: BGA Assembly X-Sections
Section 10: BGAs Re-Balled Section 11: SMT Assembly Defects
(Upcoming)Section 13: SMT PWB PadsSection 14: PWB Vias, X-Sections
Do you have images of solder-joint or other interconnect features or defects that you would want to share? Send them to Holly Collins at SMT, editorial@iconnect007.com. You must obtain permission to publish the photos and may not show proprietary or company-specific information on the images. We are particularly interested in images of advanced SMT assembly technologies and failure analyses.