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SMTAI to Discuss PCB Technology Challenges
September 30, 2011 | SMTAEstimated reading time: 1 minute
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place Tuesday, October 18, 2011 during their annual conference, SMTA International, in Ft. Worth, Texas. Gil White, DDi Global, will chair the session and Laura Turbini, Ph.D., Research in Motion, will co-chair.
The session covers the challenges with the co-planarity of both the substrate package and the PCB motherboard. Presenters will discuss if room temperature co-planarity measurements predict co-planarity at lead-free assembly temperatures; challenges and solutions for filling of through holes and blind microvias with a copper electroplating process to provide a thermal path or a planar surface for assembly; and will also discuss the process, and how to quantify and benchmark PCB suppliers in terms of process capability, quality and relative reliability for ATE PCBs. Papers will be presented by speakers from Intel Corporation, Atotech GmbH and Texas Instruments, Inc.
"Solutions for today's and tomorrow's PCB challenges are the key to providing Next Generation products," commented White.
Details about SMTA International can be found here or by contacting SMTA administrator JoAnn Stromberg at 952-920-7682.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies and related business operations. For more information, visit www.smta.org.