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Past, Present and Future of Package-on-Package
November 2, 2011 | Real Time with...SMTAIEstimated reading time: Less than a minute
Package-on-package (PoP) technology has enabled PCB designers to conserve board real estate and reduce crosstalk, while simplifying testing of the decoupled memory and logic devices. SMTAI keynote speaker Lee Smith of Amkor Technology discusses PoP technology, ongoing industry collaboration, and standards development.
To watch this video, click here.