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Board-Level Defects Examined
July 11, 2012 |Estimated reading time: Less than a minute
Dr. Jennie S. Hwang discusses key issues related to board-level defects, such as pad cratering, conductive anode filament formation (CAF), and solderability defects. Dr. Hwang also notes that lead-free assembly has placed significant stress on printed wiring board assemblies and discusses packaging trends such as BTC.Watch the interview here.