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Modern Cleaning Challenges in Post Reflow Applications
March 12, 2013 |Estimated reading time: Less than a minute
Kyzen Chief Technology Officer Dr. Mike Bixenman discusses modern challenges in post-reflow cleaning/defluxing applications. Low stand-off heights, increased reflow temperatures, and increased assembly densities contribute to the challenges faced when cleaning assemblies. Dr. Bixenman also addresses cleaning standards and challenges associated with a lack of clearly defined standards.Watch the interview here.