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Package-under-Package: A 2D Option with 3D Benefits
April 30, 2013 | Joe Fjelstad, Verdant ElectronicsEstimated reading time: Less than a minute
The three-dimensional interconnection of electronic devices continues to hold sway over the minds and imaginations of electronic product developers around the globe. Its growing attraction stems from the fact that 3D assembly offers a means for addressing the challenge presented by the electronic industry’s desire to pack more function in to the same, or lesser, amount of space. Looking back, it is nothing short of amazing to see how electronic packaging and interconnection engineering teams around the globe have continued to deliver on the industry mantra of “smaller, faster, better, lighter, and cheaper” and increasing interconnection density has been a centerpiece of the effort. The fact is, 3D assembly is not all that new and was actually first proposed in the earliest days of the electronics industry, but it has definitely become the latest “go-to” technology to continue the tradition of getting more “stuff” into less space.Read the full article here.This column originally appeared in the April 2013 issue of SMT Magazine.