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Inclusion Voiding in Gull Wing Solder Joints
June 4, 2013 |Estimated reading time: Less than a minute
Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC-7095 which define industry recommended BGA solder workmanship criteria and methods of inspection. Solder voiding limits associated with other, non-BGA, SMT solder joint types however are neither well defined nor well understood in the industry. According to IPC guidelines, the amount and size of solder voids are simply to be specified by customer/vendor agreement. In the absence of well-defined voiding criteria though, the morphology of solder joint fillets seen in final visual inspection often becomes the sole arbiter of solder workmanship and quality. Among the various SMT solder interconnect designs used in IBM applications, one of the more common SMT leaded structures is the gull wing design found on SMT connectors.Read the full article here.Editor's Note: This article was originally published in the May 2013 issue of SMT Magazine.