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Surface Tension and Load-Carrying Capacities of Solder
June 12, 2013 |Estimated reading time: Less than a minute
Reflow soldering on both sides of a board is standard procedure in the SMT manufacturing process. When the second component side is soldered, the components hang upside-down on the PCB. When the reflow process reaches its peak range, the possibility of remelting previously finished solder joints cannot be ruled out, which leaves the component hanging directly from the molten solder. Manufacturers count on the load-carrying capacity of molten solder millions of times a day. Figure 1 shows a component hanging from a drop of solder. Molten solder is entirely capable of bearing considerable component weight.Read the full article here.Editor's Note: This article originally appeared in the May 2013 issue of SMT Magazine.