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A Novel Glass Substrate for Pure Glass PCBs
July 9, 2013 | Real Time with...IPCEstimated reading time: Less than a minute
Guest Editor Bob Neves talks with CEO Jeb Flemming of 3D Glass Solutions about a new glass ceramic-based substrate for electronics. This substrate mitigates RF issues, allows extremely high densities, and uses conventional wet-etch technologies to produce vias en masse.Watch the interview here.