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Advanced Rework Technology and Processes for Next-Gen Packages
December 3, 2013 |Estimated reading time: 1 minute
AbstractBGA rework is now largely mature, although new supplemental processes that provide improved process control such as solder paste dipping and non-contact site cleaning can now be integrated into existing processes if the rework technology that is used allows.
So, what is the next set of challenges that will need to be addressed in regard to area array and SMT rework? The International Electronics Manufacturing Initiative (iNEMI) has recently published its 2013 Technology Roadmap for the global electronics industry which includes a section dedicated specifically to rework and repair. Of particular interest and importance is iNEMI’s gap analysis which identifies future specific gaps and challenges that will result from such factors as government regulations, disruptive technologies and new product requirements.
This article will review five of the key rework gaps and challenges identified by iNEMI including:
- Reworking very large, next-generation area arrays on large high-thermal-mass assemblies.
- Development of hand-soldering processes for reworking 01005 components.
- Development of industry-standardized processes for reworking package-on-package (PoP) devices.
- Development of industry-standardized processes for reworking quad flat, no lead (QFN) devices.
- Development of site redressing processes that prevent lifted pads, soldermask damage and copper dissolution.
This article will discuss the five iNEMI rework gaps and challenges including identification of the key technical/process challenges, outlining in detail the efforts-to-date aimed at addressing these new challenges as well as the next steps required for complete resolution of these challenges.Read the full article here.Editor's Note: This article originally appeared in the November 2013 isssue of SMT Magazine.