-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Cookson Electronics' New Technology Group Delivers Advanced Process Engineering Expertise
August 11, 2006 |Estimated reading time: 1 minute
Cookson Electronics Assembly Materials is pleased to announce the establishment of its Global Applications Technology and Engineering group which joins Cookson's global R&D group. This effort formally integrates the extensive knowledge base of the company's field engineer network into its vast internal applications structure. The mission of this dedicated group is to assist Cookson's customers in solving their assembly technology, yield and reliability challenges through the utilization of Cookson's integrated understanding of process dynamics, and its expert internal testing and validation capabilities.<?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
"The formation of the Global Applications Technology and Engineering group gives Cookson Electronics the ability to increase its development and output of process engineering expertise into the world of electronics manufacturing," said Steve Brown, Cookson's Director of Global Applications Technology. "This new group has been formed at a time when assemblers are continually finding new practical challenges in assembly processes, as lead-free production becomes a daily reality. At the disposal of the group is our a global team of field applications engineers along with two fully automated SMT and wave soldering lines, with automatic solder paste inspection. This capability enables us to re-create and solve process problems from within Cookson Electronics labs, by using either Cookson test vehicles or customer specific PWBs."
About Cookson Electronics Assembly Materials
Cookson Electronics Assembly Materials, a Cookson Electronics company, is the global leader in the development, manufacturing and sales of innovative materials used in electronic assembly processes. With a unique worldwide presence in 50 locations throughout the <?xml:namespace prefix = st1 ns = "urn:schemas-microsoft-com:office:smarttags" />Americas, Europe and the Asia/Pacific region, CEAM supplies a full line of Solder Paste, Stencils, Squeegee Blades, Stencil & PCB Cleaners, Bar Solder, Cored Wire Solder, Wave Soldering Fluxes, and SMD Adhesives. CE Analytics is Cookson's resource for diagnostics solutions, analytical services and applications expertise. Cookson Electronic Semiconductor Packaging is the leader in EMC and polymeric materials for semiconductor packaging. Since its founding in 1872, Cookson has been committed to developing and manufacturing the highest quality soldering materials. That tradition continues today through its innovative products, including its line of environmentally friendly, lead-free electronic assembly products. For more information, visit www.cooksonelectronics.com .