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Big Ideas on Miniaturisation
March 5, 2014 |Estimated reading time: 1 minute
Abstract
The next generation of miniaturised SMT devices waiting to make their mark will require the assembly community to rethink its processes and toolsets. The feature sizes that are involved in this new wave of miniaturisation are sub-200 microns. To put this into context, only a decade ago this would have been considered a Semicon domain.
Of all the process involved within the surface mount assembly process the printer is certainly the most sensitive to these changes. But it’s not only about printing miniaturised features--the process engineer has to balance miniaturisation with the requirements of “standard” technology. Thus we are experiencing the age of heterogeneous assembly.
Therefore, the miniaturisation program is causing the print process to be challenged in new ways, especially the impact on the available process window available to achieve high-yield heterogeneous assembly.
This paper will investigate the impact of miniaturisation and heterogeneous assembly on the print process and strategies for assemblers to keep one generation ahead. In recent research work, actual paste deposit volumes and transfer efficiency have been monitored and compared for both square and round apertures with area ratios ranging from 0.20 to 1.35. This covers apertures sizes of between 100 and 550 microns in a nominal 100-micron thick stencil foil. In addition, the effect of ProActiv ultrasonically activated squeegees has been assessed as part of the same experiment. A further comparison has also been made between type 4 and type 4.5 solder paste as well.
The data presented here will help provide guidelines for stencil aperture designs and strategies for ultra-fine pitch components such as 0.3CSPs.Read the full article here.Editor's Note: This article originally appeared in the February 2014 issue of SMT Magazine.