-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Assembly Materials for High-Temperature Applications
April 2, 2014 |Estimated reading time: 1 minute
New technology trends in the automotive market include high-power modules for e-mobility, and a combination of logic and power which will be developed for increased economy, safety and reliability. One of the most important challenges is the electrical system and the realization of complete energy management. The connection between sensor, logic and control units, as well as power transmission for electrical vehicles, is the electronics assembling technology.
Figure 1: Assembly of a power module.
This article will discuss and show results of reliability in soft soldering alloys (based on lead-free requirements) for higher temperatures (>125°C to 175°C), as well as possibilities for different applications. Therefore, it will present the basis of the material and the realization for processes for the electronics assembly technology. Furthermore alternatives and development stages for temperatures above 200°C will be discussed.
Introduction
Important requirements for applications that combine power and logic devices include:
- High power density;
- High reliability;
- High heat conductivity;
- Ambient condition more than 150°C;
- Lead-free technology;
- Lifetimes longer than 15 years;
- Cost; and
- And of course, optimum methods for combining power and logic.
This leads to a need for assembly materials with improved properties.
As state-of-the-art for power modules’ preforms and solder paste are based on eutectic tin/silver (SnAg3.5) or tin/silver/copper (SAC) with 3 or 4% silver, the eutectic SnAg3.5 alloy has worked up to 125°C for years. For temperature above 125°C, these alternatives can be used:
- Special alloys for soft soldering (e.g., HT1);
- Sinter paste/Sinter adhesive; and
- Diffusion soldering (e.g., HotPowCon [HPC]).
Read the full article here.Editor's Note: This article originally appeared in the March 2014 issue of SMT Magazine.