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Mechanical Reliability: A New Method to Forecast Drop Shock Performance
June 17, 2014 |Estimated reading time: 1 minute
Abstract
In light of the recent technological trends within PCB manufacturing industry, there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durability of mobile devices.
In the past, many papers focused on PCB reliability and the influence factors during drop shock test. In most cases, the potential influence factors in regards to underfill have not been fully investigated. Additionally, there is no clear direction on the influence of the interaction between solder mask inks and underfill systems.
The intent of this article is to identify an accurate method to predict drop test behavior by understanding the surface tension of both the solder mask ink and the underfill material. This could become a significant advantage for improving the reliability of the entire electronic construct. In this paper a method has been examined that can be used to subsequently analyze the reliability of the latest mobile device related materials and design.
The prescribed test has been constructed using a cross comparison of pad design, surface finish, solder mask and underfill, measured by drop testing. Based on the resulting data, a method was evaluated to predict and optimize drop test reliability by understanding the surface tension of solder mask and underfill (adhesion).
We are now able to identify specific advantages and limitations for different material combinations, without the need of expensive and time intensive drop tests.
In an effort to achieve a broader understanding of the entire process and product scope, the participants in these trials were an HDI PCB manufacturer (AT&S) and its material suppliers.
Introduction
Continual miniaturization and RoHS requirements have significantly aggravated the endeavor to achieve customer expectations in terms of reliable electronic devices. Drop shock performance has especially become an important factor in the past several years, due to the increasing number of portable electronics, such as mobile devices, MP3 players and tablet computers. Read the full article here.Editor's Note: This article originally appeared in the May 2014 issue of SMT Magazine.