-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
NPL to Hold Webinar on Power & High-temp Manufacturing
August 8, 2014 |Estimated reading time: 1 minute
National Physical Laboratory (NPL) will hold "Power and High Temperature Manufacturing Webinar" September 10, 2014, from 12:00 p.m to 1:00 p.m. EDT. The presenters are Dr. Chris Hunt, NPL, and Bob Willis, NPL Defect Database coordinator. An increase in the demand for high temperature interconnect solutions exists due to recent introductions of high-power semiconductors. Application areas for these new devices include electric vehicles and renewable energy. Characterization of electronic interconnect properties operating at temperatures above 200ºC, has not been undertaken in great detail. These new materials form different interconnection joints, dimensionally, structurally, and with different bond strengths. Understanding the degradation mechanism for these material solutions is in its infancy. We will also outline some of the existing interconnection methods and materials used for organic printed circuit substrates for high-temperature operation up to 200ºC. Although there are many applications and companies running these processes there is very little literature in the public domain on PCB assembly. You will have the opportunity to obtain a copy of the latest NPL report on "High Temperature materials" produced by the NPL Electronics Interconnection Group. Topics covered include:
- What is high temperature and what does it mean?
- Application and design requirements.
- Use of liquid solder and sintered pastes.
- Reliability testing and characterising of joints.
- Assembly processes for high-temperature PCBs.
- Process and design defects.
Register for this free webinar today. The feature and webinar are supported by SMT magazine.