Reading time ( words)
Cleaning processes that are pH-neutral have become a trend-setter in semiconductor and power-electronics applications, and concentration management is simplified by full closed-loop control. Zestron's Harald Wack and Todd Scheerer explain the technical and environmental benefits.
Watch the interview here.
Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.
I-Connect007 Editorial Team
We interviewed two of this year’s IPC President’s Awards, Joe Kane of BAE Systems and Zhiman (Susann) Chen of Zhuzhou CRRC Times Electric Co., Ltd. The IPC President’s Award is given to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronics interconnect industry. The award is a personal honor to recognize the winners’ selfless dedication to the electronics industry in terms of their time, expertise, and leadership.