Exact Science Implemented at Kester for Increased Reliablity


Reading time ( words)

Kester's Bruno Tolla and Dr. Yanrong Shi discuss with Guest Editor Steve Williams the importance of fully understanding their many solder formulations with respect to solderability and reliability, as related to customer needs and applications. With their fully equipped lab Kester's team can delve deeply into understanding the interactions of the chemistry involved, all of which can affect solderability performance.

To watch the interview, click here.

Share

Print


Suggested Items

Defense Speak Interpreted: PERM—Pb-free Electronics Risk Management

12/18/2018 | Dennis Fritz, Fritz Consulting
In this column, we explore PERM—the Pb-free Electronics Risk Management Consortium. No, the group members do not all have curly hair! The name was chosen around 2008 by a group of engineers from aerospace, defense, and harsh environment (ADHE) organizations.

Greatest Challenges in Soldering

12/12/2018 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

12/14/2018 | Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.



Copyright © 2018 I-Connect007. All rights reserved.