AIM's Dr. Mehran Maalekian Presented at ICSR Toronto


Reading time ( words)

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces that Dr. Mehran Maalekian, AIM’s Research and Development Manager, presented his paper on lead-free solders at ICSR Toronto on May 20th, 2015. The International Conference on Soldering and Reliability has quality speakers every year covering topics such as; stencils for disparate-sized components, tin whiskers, head-in-pillow, and reliability issues. This year there were two speakers covering the topic of lead-free solders including AIM’s Mehran Maalekian.

Dr. Maalekian’s paper compared the physical, mechanical and soldering properties of three commercial lead-free solders; Castin, Babbitt and SAC-I and modifications of these alloys.  In total, six alloys with compositions in the range of (major elements) Sn/Cu(0.7-4)/Ag(0-4)/Sb(0.5-8)/Bi(0-3)/Ni(0-0.15) were tested. Effects of alloying elements on the thermal behavior (melting and solidification), wetting force, contact angle, spreading, tensile and hardness properties were discussed. Based on preliminary results, the most desirable alloy modification was produced and its properties were compared against the commercial creep resistant solder alloy, i.e. SAC-I.

Dr. Mehran Maalekian is experienced in materials engineering with a focus on physical metallurgy, soldering, modelling in materials engineering, and thermo-mechanical processes. Since the start of his career Dr. Maalekian has received numerous recognitions such as; the National Sciences and Engineering Research Council of Canada Award, the Henry Granjon Prize, and IWS-Sossenheimer Award. Dr. Maalekian has been involved in numerous research studies and papers in the industry.    

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.

Share

Print


Suggested Items

Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee

02/20/2020 | Patty Goldman, I-Connect007
With over 32 years spent working with IPC, Steve Pudles was elected to the IPC’s Hall of Fame this year. Patty Goldman spoke with Steve about how he first became involved as well as his time in the organization, including his work with the EMS Management Council.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

True or False: CFX Edition

02/06/2020 | David Bergman, vice president, Standards and Training, IPC
Early in 2019, IPC published IPC-2591— Connected Factory Exchange (CFX), Version 1.0. This standard was developed by the IPC Connected Factory Initiative Subcommittee over a two-year period to address issues with machine-to-machine communication and provide the electronics manufacturing industry with a true plug-and-play system for any company to achieve Industry 4.0.



Copyright © 2020 I-Connect007. All rights reserved.