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Indium Corp. will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan.
Indium's Flip-Chip Fluxes eliminate the cost of cleaning flux residues and prevent damage to the die from stresses during cleanings.
Flip-Chip Flux NC-26-A is generally used in mobile flip-chip packages; Flip-Chip Flux NC-26S is designed for larger fine pitch die (≤60micron); and Flip-Chip Flux NC-699 delivers the lowest residue of any flux in use in flip-chip production.
Indium's Flip-Chip Fluxes provide enhanced activity control that avoids the two main soldering issues: solder bridging and cold joints. This flux technology also retains bump height after reflow, reduces the UBM/bump crack damage in the cleaning process, and boasts a high compatibility with capillary and molded underfills (CUF and MUF).
For more information on ultra-low and near-zero residue no-clean Flip-Chip Fluxes, stop by Indium's booth, #3012.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information on Indium, visit www.indium.com.