Solder Paste and Solder Joint Automatic Inspection Experience at SMTA International

Reading time ( words)

The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.

The special feature area, supported by SMTA & NPL, will include live printing of ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It will also include AOI inspection of printed board assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show the machines' capabilities.

Bob Willis, feature area organizer, will present a complimentary webinar on September 15 covering Solder Paste Inspection, Quality Control, Common Print and Reflow Problems - Causes & Cures. He will also showcase the activity at SMTA International.

Companies that supply equipment, materials, or products related to solder paste or solder joint automated optical inspection are welcome to partner with SMTA to showcase your products to attendees. To sign up or for further information contact Emily Stuckmayer at (952) 920-7682.

Current supporting partners to date include ASM Assembly Systems, FCT Assembly, Kester, Mirtec, SmartLoop, Tagarno, and Yxlon.

Details of the Solder Paste and Solder Joint Automatic Inspection Experience can be found here or contact SMTA Administrator JoAnn Stromberg: 952-920-7682 or

 About SMTA

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.



Suggested Items

Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields

09/16/2020 | Real Time with...SMTAI
KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.

Just Ask Eric: Selecting the Right Lead-Free Solder for Your Application

09/15/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes and assist with the identification of electronic hardware failures utilizing various analytical techniques. He also specializes in optimizing PCBA processes and identifying hardware failures through analysis. We hope you enjoy “Just Ask Eric.”

Just Ask Joe: The Occam Process

08/25/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

Copyright © 2020 I-Connect007. All rights reserved.