Reliability Study of Bottom Terminated Components (Part 1)


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Figure 5: LGA Images_ Non-identical Pad Size for Signal and Ground Pins.

Table 1: Component Details

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Thermal Cycle Test Conditions

The thermal cycle testing was performed in an air-to-air thermal cycle chamber, from 0 to 100°C with 10-minute dwell time at each peak temperature, and a temperature ramp rate and cooling rate of approximately 10-15°C per minute. The chamber profile of temperature versus elapsed time is shown in Figure 6.

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Figure 6: Thermal Cycle Temperature Profile - 0 to 100°C

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