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SHENMAO PF606-P26 No-Clean / Zero Halogen Solder Paste are made locally in the USA and with the same quality in seven other worldwide locations. It is said to prevent BGA Non-Wet Opens and Head on Pillow defects if there is oxidation on BGA Balls or PCB Pads. In case BGA components are warped, PF606-P26 thru excellent printability, wetting and solder ability can create highly reliable Solder Joints that greatly reduce their failure rate.
SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Flux and PV Ribbon.