Multitest’s MT9510 Offers New Contact Site Layouts

Reading time ( words)

Multitest’s well-established MT9510 tri-temp pick and place handler is now available with various site pitch layouts, which are compatible with major standard handlers in the market. The new site pitch layouts enable to customer to re-use existing loadboards from other handling equipment for applications on the MT9510.

The Multitest MT9510 is a kitable tri-temp pick and place handler, which is known for its superior temperature performance and a wide range of options to address specific customer requirements. With an installed base of more than 800  the MT9510 platform is highly accepted in Asia, Europe and USA. The site pitch compatibility now allows for easy and economic transfer of applications form other handling equipment to this highly reliable system by reusing the existing test interface boards.

The MT9510 platform supports parallel test of up to 8 devices (MT9510 XP) or up to 16 devices (MT9510 x16) with up to 4 (MT9510 XP) or 8 (MT9510 x16) horizontal sites. The new site pitch layout for quad setups allows for horizontal site pitches from 40mm up to 80 mm and vertical site pitches from 60 mm up to 63.5 mm. The new site pitch layouts require only a minor modification of the handler base and therefore are backward compatible to a standard MT9510 site pitch.

Syariffuddin A.Kamarudin, Product Manager for the MT9510 platfrom adds: “The new site pitch layout option not only allows an easy transfer of standard applications from other pick and place handler brands, but also make the MT9510 compatible for the Multitest MEMS modules, which have been developed for the Multitest gravity feed product line. Beyond the direct reuse of existing test interface boards, we see our customer leveraging the loadboard compatibility at their engineering sites, where they now can use the exact same board design for package characterization, as it will be used later in volume production”

To learn more please visit    

About Multitest

Multitest (headquartered in Rosenheim, Germany) is one of the world’s leading manufacturers of semiconductor material handling equipment and interfaces for the testing and calibration of semiconductors and sensors. Multitest markets a broad portfolio of innovative and performance driven test handlers, contactors and ATE printed circuit boards. Multitest has more than 30 years of experience in the semiconductor industry, providing solutions to the automotive, consumer, communication, and sensor markets. Multitest is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources. Additional information can be found at and



Suggested Items

The Long Road to a New Standard

09/17/2019 | Barry Matties, I-Connect007
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

Copyright © 2020 I-Connect007. All rights reserved.