ZESTRON to Showcase Latest pH Neutral Products at SMTA Ohio Expo and Tech Forum


Reading time ( words)

ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing industry, will be exhibiting the latest in pH neutral cleaning solutions at the SMTA Ohio Expo and Tech Forum on Thursday, July 16th. 

Since 2009, ZESTRON has provided innovative pH neutral cleaning solutions for defluxing PCBs, power electronics, and semiconductor applications.  In addition to VIGON® N 600, the latest aqueous-based products include VIGON® PE 180 and HYDRON® SE 220.

VIGON® PE 180 is a water-based cleaning agent developed for use in spray-in-air equipment. It removes flux residues from leadframes, discrete devices, power modules, and power LEDs following die attached and/or heat sink soldering. This cleaning agent was designed to remove oxide layers from copper surfaces in preparation for subsequent processes.

HYDRON® SE 220 is a water-based cleaning agent specifically developed for use in immersion and ultrasonic processes. It removes flux residues from a wide range of semiconductor electronics. It is easily rinsed and provides optimal surface characteristics for subsequent processes such as wire bonding and molding, while ensuring excellent material compatibility.

The SMTA Ohio Expo and Tech Forum will be held at the Doubletree Cleveland – Independence, 6200 Quarry Lane, Independence, OH 44131.  For more information on ZESTRON’s pH neutral process solutions and services as well as our free webinar on July 16th, titled “DI-water and Low Standoff Cleaning Challenges” please visit our tabletop exhibit.  Our team stands ready to provide comprehensive solutions to your cleaning needs.

Share

Print


Suggested Items

Joe Fjelstad Breaks Down His Occam Process

03/04/2020 | I-Connect007 Editorial Team
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

Stencils: Not As Simple As They Seem

02/26/2020 | I-Connect007 Editorial Team
Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.

The Convergence of 5G and Automotive

01/08/2020 | Barry Matties, I-Connect007
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.



Copyright © 2020 I-Connect007. All rights reserved.