-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
A Rework Dilemma: PCB Shields
July 15, 2015 | Bob Wettermann, BEST Inc.Estimated reading time: 1 minute
RF shields minimize radio frequency (RF) noise to prevent it from affecting the sensitive and critical electronic components beneath the shield. They also prevent such noise from interfering with neighboring devices or other systems in the vicinity. RF shields typically have a unique design and conform to the layout of the PCB. Often, the shields are not regular-shaped designs; rather, they are designed and are shaped by the PCB layout. Typically, these shields can be found on handheld wireless device PCBs such as smartphones, netbooks, tablets, portable medical devices and audio/video players, to name a few.
There are two basic construction types for these shields. Some of them are a two-piece construction with a "fence" soldered to the PCB and a cover fitted over this fence.
Other shields are a one-piece construction with an open-sided can overlaying the components and soldered to the PCB. These one-piece shields are a serious challenge to rework and will be the focus of this rework discussion.
Challenges of shield rework
There are numerous challenges associated with reworking shields, including, but not limited to:
1. Devices are very tight and close to the shield itself—many times within a few millimeters. This means that the rework process, if not precisely controlled, can present problems in disturbing nearby devices.
2. Shield trace solder excavation and PCB board prep are challenging as well, especially for odd-shaped shields. Manual methods require extreme dexterity as the distance between the land of the shield and neighboring devices is very small. This means that neighboring devices can be disturbed.
Resoldering of the shields can be very challenging as the gap between the shield lip and the board needs to be closed so as to not allow for any ingress or egress (in some cases) of RF signals. This means there is little room for error.
Editor's Note: This article originally appeared in the July 2015 issue of SMT Magazine.
Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.